JPH0126203B2 - - Google Patents
Info
- Publication number
- JPH0126203B2 JPH0126203B2 JP2713582A JP2713582A JPH0126203B2 JP H0126203 B2 JPH0126203 B2 JP H0126203B2 JP 2713582 A JP2713582 A JP 2713582A JP 2713582 A JP2713582 A JP 2713582A JP H0126203 B2 JPH0126203 B2 JP H0126203B2
- Authority
- JP
- Japan
- Prior art keywords
- delay line
- inductance element
- bobbin
- conductor
- inductance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 26
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000002356 single layer Substances 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 description 30
- 238000010168 coupling process Methods 0.000 description 30
- 238000005859 coupling reaction Methods 0.000 description 30
- 238000010586 diagram Methods 0.000 description 8
- 230000007423 decrease Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/30—Time-delay networks
- H03H7/32—Time-delay networks with lumped inductance and capacitance
Landscapes
- Coils Or Transformers For Communication (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2713582A JPS58145209A (ja) | 1982-02-22 | 1982-02-22 | 遅延線 |
US06/467,635 US4570135A (en) | 1982-02-22 | 1983-02-18 | Delay line |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2713582A JPS58145209A (ja) | 1982-02-22 | 1982-02-22 | 遅延線 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58145209A JPS58145209A (ja) | 1983-08-30 |
JPH0126203B2 true JPH0126203B2 (en]) | 1989-05-23 |
Family
ID=12212604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2713582A Granted JPS58145209A (ja) | 1982-02-22 | 1982-02-22 | 遅延線 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58145209A (en]) |
-
1982
- 1982-02-22 JP JP2713582A patent/JPS58145209A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58145209A (ja) | 1983-08-30 |
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